The integrated circuit with each new generation has been characterized by increasing
functionality. In the 1980’s Very Large Scale Integrated Circuits (VLSIC) began to
emerge with transistor counts approaching one million plus per chip! The IC package
quickly became more than a “chip carrier”. Now the packaging had to address the
electrical, mechanical and thermal requirements of the IC, and had to do so costeffectively.
A package costing more than the chip was not an option. In addition, the
demands of the marketplace for product that was “smaller, better and cheaper” came
As a result the late ‘80s saw paradigm shifts in IC packages and packaging options.
Area array packages, in particular, the Ball Grid Array (BGA) began to emerge
that more effectively addressed increasing chip I/O count. Ceramic packaging for
high performance circuits (microprocessors digital signal processors) gave way to
organic based packages, the plastic BGA (PBGA), offering a more favorable solution
to package cost. And the hybrid circuit suddenly became a multichip module!
Over the past 15 years the author has developed and presented professional development
courses at various technical symposia as well as on-site at semiconductor,
component and equipment manufacturers and materials suppliers facilities. The
courses have covered topics that make up the electronic manufacturing arena focusing
on packaging and assembly of the integrated circuit.